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MMIC Fabrication Techniques and Wireless Communication Comparisons

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Monolithic Microwave Integrated Circuits (MMICs) are integrated circuits where all active and passive elements, components, and connections are fabricated simultaneously on a single substrate. This is achieved through various deposition techniques, some of which are described below.

The primary MMIC fabrication techniques include:

  • Diffusion
  • Ion Implantation
  • Epitaxial Growth
  • Lithography
  • Photo Etching
  • Deposition

MMIC fabrication necessitates careful selection of the dielectric substrate material and the fabrication process itself. Substrate materials for MMICs are chosen based on their function:

  • Substrate Materials: For mounting electronic devices (e.g., Alumina, Ferrite, GaAs, Sapphire).
  • Conductor Materials: For printing patterns and creating ground planes (e.g., Aluminium, Copper, Gold, Silver).
  • Dielectric Materials: For capacitors and blockers (e.g., SiO, Si3N4, Al2O3, Ta2O5, SiO2).
  • Resistive Materials: For bias networks, attenuators, and terminations (e.g., Cr, NiCr, Ta, Ti).

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