Dielectric vs. Resistive Materials: Properties and Applications
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This article outlines the differences between dielectric and resistive materials. Both types are crucial in MMIC (Monolithic Microwave Integrated Circuit) fabrication.
Dielectric Material Properties
A good dielectric material should possess the following characteristics:
- Higher Voltage Withstanding Power: It should be able to withstand high voltages without breaking down.
- Low Dielectric Loss: Minimal energy should be lost within the material when subjected to an electric field.
- Good Reproducibility: The material properties should be consistent and easily reproducible during manufacturing.
Resistive Material Properties
A good resistive material should possess the following characteristics:
- Low-Temperature Coefficient Resistance: The resistance should remain relatively stable despite changes in temperature.
- Good Stability: The material’s properties should remain consistent over time and under various operating conditions.
- Good Heat Dissipation Ability: It should be able to efficiently dissipate heat generated due to current flow.
- Higher Surface Resistivities: Higher resistance values are often desirable for circuit design flexibility.
Material Properties Table
The following tables list common materials, their deposition techniques, and key electrical properties for both dielectric and resistive material:
Dielectric Materials
Dielectric Material | Deposition Technique | εr |
---|---|---|
SiO | Evaporation | 6-8 |
SiO2 | Deposition, Sputtering | 4 |
Al2O3 | Anodization, Evaporation | 7-10 |
Ta2O5 | Anodization, Sputtering | 22-25 |
Resistive Materials
Resistive Material | Deposition Technique | Resistivity, Ohm/Square |
---|---|---|
Cr | Evaporation | 10-1000 |
NiCr | Evaporation | 40-400 |
Ta | Sputtering | 5-100 |
Ti | Evaporation | 5-2000 |
Cr-SiO | Evaporation | 600 |