BGA (Ball Grid Array): Advantages and Disadvantages

This article explores the pros and cons of Ball Grid Array (BGA) technology.

What is BGA? (Introduction)

• BGA stands for Ball Grid Array. It’s a type of Surface Mount Package (SMP) used for integrating Integrated Circuits (ICs).
• BGAs are used for permanently mounting devices.
• They offer more connection points than older packaging methods like DIL (Dual In-Line) or flat packages.
• The entire bottom surface of a BGA is used for connections, rather than just the perimeter.
• BGAs conduct signals between ICs and PCBs (Printed Circuit Boards).
• They use small solder balls for connecting the component to the board.
• BGA design results in lower inductance, which means less signal degradation.
• Inside a BGA package, the active chip can be interconnected using wire bonding.

Types of BGAs

Here are some common types of Ball Grid Arrays:

• Plastic Ball Grid Array (PBGA), as shown in the image above.
• Cavity Plastic Ball Grid Array (CPBGA)
• Ceramic Ball Grid Array (CBGA)
• Tape Ball Grid Array (TBGA)

Benefits (Advantages) of BGA

Here’s a breakdown of the advantages of using BGA packaging:

• Wide Application: Used in microcontrollers, microprocessors, RAM devices, PC chipsets, and more.
• High-Frequency Performance: Lower inductance power planes enable designs to operate at higher frequencies.
• High Pin Count: Supports a greater number of pins compared to wirebond packages.
• Improved Current Distribution: Better current distribution minimizes IR drops. In BGA, power is distributed through the top metal layer metal bumps.
• (PBGA): Excellent Thermal Compatibility with PCB: PBGAs generally offer good thermal compatibility with PCBs.
• Self-Alignment: BGA components often have autoregistration capability during soldering.
• Cost-Effective: Generally, BGAs offer a relatively lower cost solution.
• (PBGA): Excellent Electrical Performance: The PBGA type of BGA packaging usually has excellent electrical performance.
• Heat Dissipation: CBGA and TBGA types provide better heat dissipation compared to PBGAs.

Drawbacks (Disadvantages) of BGA

Despite their advantages, BGAs also have some drawbacks:

• (PBGA & TBGA): Sensitive to Humidity: PBGA and TBGA types are susceptible to moisture.
• (CBGA): Poor Thermal Compatibility with PCB: CBGA can have issues with thermal compatibility with the PCB, and they are more expensive.
• (CBGA): Poor Autoregistration Capability: The CBGA type may not self-align as well during soldering.
• (TBGA): Lower Reliability: TBGAs tend to have relatively lower reliability compared to other BGA types.