Terminology » RF Components » BGA (Ball Grid Array): Advantages and Disadvantages

BGA (Ball Grid Array): Advantages and Disadvantages

bga ball grid array electronic packaging surface mount component

This article explores the pros and cons of Ball Grid Array (BGA) technology.

What is BGA? (Introduction)

  • BGA stands for Ball Grid Array. It’s a type of Surface Mount Package (SMP) used for integrating Integrated Circuits (ICs).
  • BGAs are used for permanently mounting devices.
  • They offer more connection points than older packaging methods like DIL (Dual In-Line) or flat packages.
  • The entire bottom surface of a BGA is used for connections, rather than just the perimeter.
  • BGAs conduct signals between ICs and PCBs (Printed Circuit Boards).
  • They use small solder balls for connecting the component to the board.
  • BGA design results in lower inductance, which means less signal degradation.
  • Inside a BGA package, the active chip can be interconnected using wire bonding.

BGA cross section view

Types of BGAs

Here are some common types of Ball Grid Arrays:

  • Plastic Ball Grid Array (PBGA), as shown in the image above.
  • Cavity Plastic Ball Grid Array (CPBGA)
  • Ceramic Ball Grid Array (CBGA)
  • Tape Ball Grid Array (TBGA)

Benefits (Advantages) of BGA

Here’s a breakdown of the advantages of using BGA packaging:

  • Wide Application: Used in microcontrollers, microprocessors, RAM devices, PC chipsets, and more.
  • High-Frequency Performance: Lower inductance power planes enable designs to operate at higher frequencies.
  • High Pin Count: Supports a greater number of pins compared to wirebond packages.
  • Improved Current Distribution: Better current distribution minimizes IR drops. In BGA, power is distributed through the top metal layer metal bumps.
  • (PBGA): Excellent Thermal Compatibility with PCB: PBGAs generally offer good thermal compatibility with PCBs.
  • Self-Alignment: BGA components often have autoregistration capability during soldering.
  • Cost-Effective: Generally, BGAs offer a relatively lower cost solution.
  • (PBGA): Excellent Electrical Performance: The PBGA type of BGA packaging usually has excellent electrical performance.
  • Heat Dissipation: CBGA and TBGA types provide better heat dissipation compared to PBGAs.

Drawbacks (Disadvantages) of BGA

Despite their advantages, BGAs also have some drawbacks:

  • (PBGA & TBGA): Sensitive to Humidity: PBGA and TBGA types are susceptible to moisture.
  • (CBGA): Poor Thermal Compatibility with PCB: CBGA can have issues with thermal compatibility with the PCB, and they are more expensive.
  • (CBGA): Poor Autoregistration Capability: The CBGA type may not self-align as well during soldering.
  • (TBGA): Lower Reliability: TBGAs tend to have relatively lower reliability compared to other BGA types.